SUNUS
VACUUM FILLING & SCREEN PRINTING
Equipment
Vacuum Filling & Screen Printing
Precision-filled vias are critical to the electrical and thermal performance of your boards. We searched the market for the best automation to handle this task.
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Download product specifications, datasheets and product brochures:
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Application: Carrier board, Glass substrate, PCB high density hole, through hole, blind hole, back drilling, vacuum resin plug operation.
Characteristics:
IC carrier board and ≥ 300,000 high density hole products.
AI server ultra-high aspect ratio ≥50:1 PCB products.
A small number of diverse material number without special production of screen plate and fixture plate.
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Application: Suitable for PCB hard and soft board resin, copper glue, silver glue vacuum hole filling, especially suitable for high aspect ratio mass production.
Characteristics:
The use of the original double table design, double increase production capacity, compared with a single surface vacuum hole machine in the occupation space, manual configuration, tool materials, energy consumption basically does not increase under the condition, production capacity increased by 1.5-2 times, to create a high return on investment for customers.
The equipment operating parameters are set by one click, the common setting unit: jack speed, jack pressure, plate height, jack stroke, etc. are integrated into the man-machine interface, highly standardized data management, reduce the operator's experience dependence, more convenient to use, skilled mold change time ≤30min.
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Application: It is suitable for vacuum hole filling of resin, green oil, Glass substrate, copper paste and silver paste of carrier board, similar carrier board and high order HDI board, especially suitable for mass production with high aspect ratio.
Characteristics:
CCD automatic alignment
Innovative design of automatic plate clamp/scraper parallel & constant pressure system
Innovative design of the net bottom automatic cleaning system
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Application: Vacuum hole filling operation of PCB hard and soft board resin, copper glue and silver glue, including through hole, blind hole, back hole, and large thickness diameter ratio resin jack.
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Application: It is suitable for high precision vacuum jack hole of resin, green oil, copper paste and silver paste of carrier board, similar carrier board, high order HDI, semiconductor package etc.
Characteristics:
The original streamline design, with excellent operation convenience, to achieve automation, data, intelligent production scene.
CCD replaces manual to achieve high-precision intelligent alignment.
The innovative design of the net bottom automatic cleaning and scraper automatic constant pressure system.
